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Funding Round

Series A - Bump Technologies

Series A - Bump Technologies

Investment Firm

Overview

Bump Technologies builds mobile apps and APIs that allow two smartphones to identify one another and connect by being bumped together.

Announced Date

Oct 24, 2009

Funding Type

Series A

Highlights

Location

United States, North America

Social

Investor Lead

Sequoia Capital

Sequoia Capital

Sequoia Capital is a crowdfunding and early_stage_venture and initial_coin_offering and late_stage_venture and post_ipo and seed and venture firm.

Participant Investors

6

Investor Name
Participant InvestorSV Angel
Participant InvestorJoshua Schachter
Participant InvestorMichael Parekh
Participant InvestorSherpalo Ventures
Participant InvestorSequoia Capital

Round Details and Background

Bump Technologies raised $3400000 on 2009-10-24 in Series A

Bump Technologies builds mobile apps and APIs that allow two smartphones to identify one another and connect by being bumped together.

Company Funding History

3

Announcment DateTransaction NameNumber Of InvestorsLead InvestorMoney Raised
Jan 10, 2011
Series B - Bump Technologies
5-16.5M
Oct 24, 2009
Series A - Bump Technologies
6-3.4M
Jun 01, 2009
Seed Round - Bump Technologies
2-undefined

Recent Activity

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